{"id":2827,"date":"2026-05-28T08:26:27","date_gmt":"2026-05-28T00:26:27","guid":{"rendered":"https:\/\/jtlcnc.com\/?p=2827"},"modified":"2026-05-28T08:26:29","modified_gmt":"2026-05-28T00:26:29","slug":"comparison-of-the-application-of-high-hardness-ceramics-and-granite-in-the-semiconductor-industry","status":"publish","type":"post","link":"https:\/\/jtlcnc.com\/ru\/2026\/05\/28\/comparison-of-the-application-of-high-hardness-ceramics-and-granite-in-the-semiconductor-industry\/","title":{"rendered":"\u0421\u0440\u0430\u0432\u043d\u0435\u043d\u0438\u0435 \u043f\u0440\u0438\u043c\u0435\u043d\u0435\u043d\u0438\u044f \u043a\u0435\u0440\u0430\u043c\u0438\u043a\u0438 \u0432\u044b\u0441\u043e\u043a\u043e\u0439 \u0442\u0432\u0435\u0440\u0434\u043e\u0441\u0442\u0438 \u0438 \u0433\u0440\u0430\u043d\u0438\u0442\u0430 \u0432 \u043f\u043e\u043b\u0443\u043f\u0440\u043e\u0432\u043e\u0434\u043d\u0438\u043a\u043e\u0432\u043e\u0439 \u043f\u0440\u043e\u043c\u044b\u0448\u043b\u0435\u043d\u043d\u043e\u0441\u0442\u0438"},"content":{"rendered":"<p>In the semiconductor industry, high-hardness ceramics (Al\u2082O\u2083, SiC, Si\u2083N\u2084, etc.) primarily target &#8220;chamber interiors \/ moving parts \/ extreme operating conditions,&#8221; while granite focuses on &#8220;large bases \/ platforms \/ vibration isolation references,&#8221; forming a clear complementary division of labor. The following is a direct comparison from four aspects: performance, typical applications, machining and assembly, and cost and selection.<\/p>\n\n\n\n<p>I. Core Performance Comparison (Semiconductor Concerns)<br>\u0422\u0430\u0431\u043b\u0438\u0446\u0430<br>Comparison Item High-Hardness Ceramics (SiC\/Al\u2082O\u2083\/Si\u2083N\u2084) Precision Granite (Jinan Green, etc.) Semiconductor Impact<br>Coefficient of Thermal Expansion Extremely low: 0.2\u20133.2\u00d710\u207b\u2076\/\u2103, close to silicon wafers Medium: 4\u20136\u00d710\u207b\u2076\/\u2103 Ceramics are more dimensionally stable under temperature differences \/ thermal cycling<br>Thermal Conductivity High (especially SiC): 150\u2013400 W\/m\u30fbK Low: 2\u20134 W\/m\u30fbK Ceramics dissipate heat well and have uniform heat distribution; granite is prone to local heat accumulation<br>Hardness \/ Wear Resistance Mohs 9\u20139.5, extremely wear-resistant, plasma-resistant Mohs 6\u20137, easily scratched by hard particles Ceramics are suitable for long-term sliding \/ chamber corrosion environments<br>Vibration Damping \/ Damping Low damping, weak shock absorption High damping (0.012\u20130.015), strong vibration suppression Granite is used for bases \/ platforms, offering stronger resistance to vibration interference<br>Density \/ Cleanliness Pore-free, non-gas absorbing \/ non-oil seeping, ultra-high purity Micro-pores, requires sealing to prevent oil contamination \/ water vapor Ceramics are better suited for high vacuum \/ cleanrooms \/ chamber interiors<br>Chemical \/ Plasma Resistance Resistant to strong acids, strong bases, and fluorine-containing plasma Not resistant to strong acids and bases, easily eroded over the long term Ceramics are used in etching \/ deposition \/ ion implantation chambers<br>Internal Stress \/ Aging Sintered molding, no natural internal stress Natural stone, requires long-term aging to relieve stress Ceramics have smaller long-term precision drift<br>Size Upper Limit Limited by sintering, mainly small to medium parts (\u2264500mm) Can be made into multi-meter ultra-large monolithic beds \/ platforms Granite is suitable for large bases of lithography machines \/ inspection machines<\/p>\n\n\n\n<p>II. Comparison of Typical Semiconductor Application Scenarios<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>High-Hardness Ceramics: First Choice for Chamber Interiors, Moving Parts, and Extreme Operating Conditions<br>Etching \/ Deposition Machines: High-purity Al\u2082O\u2083 liners, gas showerheads, focus rings, insulation rings, plasma corrosion resistant, low contamination.<br>Lithography Machine Worktables \/ Micro-motion Stages: SiC ceramics, low thermal expansion, high thermal conductivity, lightweight, ensuring nanometer-level motion stability.<br>Wafer Transfer: Si\u2083N\u2084 ceramic arms, electrostatic chucks (ESC), vacuum suction plates, anti-static, wear-resistant, no particle shedding.<br>Heat Treatment \/ Epitaxy: Ceramic heating plates, crucibles, insulation parts, long-term stability at 1000\u2103 .<br>Ion Implantation: Insulating brackets, high-voltage isolation parts, high insulation, high-voltage resistant, sputter-resistant.<\/li>\n<\/ol>\n\n\n\n<ol start=\"2\" class=\"wp-block-list\">\n<li>Precision Granite: The preferred choice for large bases, platforms, and vibration isolation references<\/li>\n<\/ol>\n\n\n\n<p>Lithography (EUV\/ArF) main machine base: Ultra-large size, high rigidity, strong vibration damping, isolates ground vibration, ensures nanometer-level positioning.<br>Wafer inspection \/ metrology equipment: CMM, optical inspection instruments, laser interferometer platforms, high flatness, long-term stability.<br>CMP equipment bed \/ guide rails: Heavy load, low vibration, good thermal stability, ensures polishing uniformity.<br>Bonding \/ packaging equipment base: Suppresses vibration, improves bonding accuracy and yield.<\/p>\n\n\n\n<p>III. Machining and Assembly Differences (Semiconductor Mass Production Concerns)<br>\u0412\u044b\u0441\u043e\u043a\u043e\u0442\u0432\u0435\u0440\u0434\u0430\u044f \u043a\u0435\u0440\u0430\u043c\u0438\u043a\u0430<br>Machining: Only diamond grinding \/ polishing; drilling, tapping, and complex cavities are extremely difficult and expensive.<br>Assembly: Mostly pre-embedded metal inserts, flexible fixation, impact-forbidden, suitable for precision assembly of small and medium-sized parts.<br>Advantages: Clean, burr-free, no particle shedding, no wafer contamination.<br>Precision Granite<br>Machining: Fully mature processes for sawing, milling, grinding, drilling, and tapping; capable of complex steps, hole systems, and embedded parts.<br>Assembly: Direct tapping, installation of threaded sleeves, rigid connection, high fault tolerance, suitable for large-scale structural integration.<br>Limitations: Micro-pores easily trap dirt; requires surface sealing \/ coating to meet cleanroom requirements.<br>IV. Cost and Selection Recommendations<br>\u0421\u0442\u043e\u0438\u043c\u043e\u0441\u0442\u044c<br>Ceramics: Expensive raw materials machining; high cost for small and medium-sized, high-precision parts.<br>Granite: High cost-performance ratio; cost for large parts is far lower than ceramics, suitable for mass-produced equipment.<br>Selection Guide (Semiconductor Scenarios)<br>\u2705 Prioritize High-Hardness Ceramics<br>Internal components of etching \/ deposition \/ ion implantation chambers (plasma-resistant, low contamination);<br>Lithography machine worktables \/ micro-motion stages, wafer transfer arms, electrostatic chucks (low thermal expansion, high thermal conductivity, wear-resistant);<br>High-temperature \/ thermal cycling conditions (heat treatment, epitaxy);<br>High vacuum \/ ultra-clean environments (non-outgassing, no particle shedding).<br>\u2705 Prioritize Precision Granite<br>Large mainframes \/ beds \/ platforms for lithography machines, inspection machines, and CMP (ultra-large size, strong vibration damping, high rigidity);<br>Precision measurement equipment sensitive to vibration but with controllable temperature differences;<br>Budget-sensitive, large-scale, mass-produced equipment bases.<br>V. One-Sentence Summary<br>High-Hardness Ceramics: The &#8220;King of High Precision and Cleanliness&#8221; for in-chamber \/ moving parts \/ extreme conditions, but brittle, difficult to machine, expensive, and cannot be made large.<br>Precision Granite: The &#8220;Stable and Heavy Skeleton&#8221; for large bases \/ platforms \/ vibration-damping references, with good vibration damping, easy machining, and high cost-performance, but susceptible to corrosion and scratching.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img alt=\"\" fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"450\" src=\"https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/05\/11.jpg\" class=\"wp-image-2828\" srcset=\"https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/05\/11.jpg 600w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/05\/11-300x225.jpg 300w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/05\/11-16x12.jpg 16w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/><\/figure>","protected":false},"excerpt":{"rendered":"<p>In the semiconductor industry, high-hardness ceramics (Al\u2082O\u2083, SiC, Si\u2083N\u2084, etc.) primarily target &#8220;chamber interiors \/ moving parts \/ extreme operating conditions,&#8221; while granite focuses on &#8220;large bases \/ platforms \/ vibration isolation references,&#8221; forming a clear complementary division of labor. The following is a direct comparison from four aspects: performance, typical applications, machining and assembly,&#8230;<\/p>","protected":false},"author":1,"featured_media":2828,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_seopress_robots_primary_cat":"","_seopress_titles_title":"","_seopress_titles_desc":"","_seopress_robots_index":"","_seopress_analysis_target_kw":"","_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_kadence_starter_templates_imported_post":false,"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[35],"tags":[],"class_list":["post-2827","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"taxonomy_info":{"category":[{"value":35,"label":"NEWS"}]},"featured_image_src_large":["https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/05\/11.jpg",600,450,false],"author_info":{"display_name":"jinxing6611@gmail.com","author_link":"https:\/\/jtlcnc.com\/ru\/author\/jtlcnc\/"},"comment_info":0,"category_info":[{"term_id":35,"name":"NEWS","slug":"news","term_group":0,"term_taxonomy_id":35,"taxonomy":"category","description":"","parent":0,"count":220,"filter":"raw","cat_ID":35,"category_count":220,"category_description":"","cat_name":"NEWS","category_nicename":"news","category_parent":0}],"tag_info":false,"_links":{"self":[{"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/posts\/2827","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/comments?post=2827"}],"version-history":[{"count":1,"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/posts\/2827\/revisions"}],"predecessor-version":[{"id":2829,"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/posts\/2827\/revisions\/2829"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/media\/2828"}],"wp:attachment":[{"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/media?parent=2827"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/categories?post=2827"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jtlcnc.com\/ru\/wp-json\/wp\/v2\/tags?post=2827"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}