{"id":3025,"date":"2026-06-30T08:35:07","date_gmt":"2026-06-30T00:35:07","guid":{"rendered":"https:\/\/jtlcnc.com\/?p=3025"},"modified":"2026-06-30T08:35:08","modified_gmt":"2026-06-30T00:35:08","slug":"comparative-table-of-core-performance-indicators-of-silicon-carbide-ceramic-substrates-for-various-application-fields","status":"publish","type":"post","link":"https:\/\/jtlcnc.com\/fr\/2026\/06\/30\/comparative-table-of-core-performance-indicators-of-silicon-carbide-ceramic-substrates-for-various-application-fields\/","title":{"rendered":"Tableau comparatif des indicateurs de performance cl\u00e9s des substrats c\u00e9ramiques en carbure de silicium pour divers domaines d'application"},"content":{"rendered":"<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Champ d'application<\/th><th>Product Type<\/th><th>Key Precision Indicators (Reference Surface)<\/th><th>Thermal Performance Indicators<\/th><th>Mechanical \/ Vibration Resistance Indicators<\/th><th>Core Application Requirements<\/th><\/tr><\/thead><tbody><tr><td>Advanced Lithography Machines (EUV \/ ArF Immersion)<\/td><td>Integrated Water-Cooled SiC Machine Base \/ Reticle Stage Base<\/td><td>Flatness \u22640.05\u03bcm\/mStraightness \u22640.03\u03bcm\/mPerpendicularity \u22640.05\u03bcm\/mSurface Roughness Ra \u22640.01\u03bcm<\/td><td>Thermal Conductivity \u2265180W\/(m\u00b7K)Coefficient of Linear Thermal Expansion \u22483.8\u00d710\u207b\u2076\/\u2103Temperature Difference Across Entire Area under Water Cooling \uff1c0.05\u2103<\/td><td>Elastic Modulus \u2265420GPaSpecific Stiffness Much Higher Than GraniteDeformation \uff1c1nm During High-Speed ScanningHigh Damping to Suppress Nanometer-Level Micro-Vibration<\/td><td>No Elastic Deformation During High-Speed Scanning; Uniform Temperature Control Eliminates Thermal Drift; Lightweight Design Reduces Driving Load, Ensuring Overlay Accuracy of 2\u20137nm<\/td><\/tr><tr><td>Wafer Metrology Equipment (CD-SEM \/ White Light Interferometer \/ Defect Inspection)<\/td><td>Medium &amp; Small-Sized Water-Cooled SiC Substrate<\/td><td>Flatness: 0.05~0.1\u03bcm\/mHeight Difference \u22640.1\u03bcm Per Whole PlateRa \u22640.02\u03bcm<\/td><td>Thermal Conductivity \u2265150W\/(m\u00b7K)Temperature Difference Under Water Cooling \uff1c0.1\u2103<\/td><td>High Rigidity to Restrain Imaging Shake; Low Dust Generation &amp; Wear Resistance<\/td><td>Avoid Warpage Caused by Local Heating to Prevent Optical Imaging Distortion; Repeat Measurement Error \uff1c2nm<\/td><\/tr><tr><td>12-inch Semiconductor Prober<\/td><td>Solid Precision SiC Substrate<\/td><td>Flatness \u22640.1\u03bcm\/mParallelism \u22640.1\u03bcm\/m<\/td><td>Thermal Conductivity: 120~160W\/(m\u00b7K); No Built-In Water Cooling, Relies on Ambient Constant Temperature \u00b10.1\u2103<\/td><td>High Density &amp; High Damping to Isolate Ground Vibration; Long-Term Wear Resistance Without Dust Generation<\/td><td>Ensure Repeated Positioning Accuracy of Probe Needles and Prevent Scrap Caused by Pad Offset<\/td><\/tr><tr><td>Wafer Polishing \/ Thinning \/ Laser Cutting Equipment<\/td><td>Solid SiC Machine Tool Base<\/td><td>Flatness: 0.1~0.2\u03bcm\/mThickness Uniformity \u22640.2\u03bcm<\/td><td>Thermal Conductivity \u2265130W\/(m\u00b7K)<\/td><td>Ultra-High Hardness, No Wear Under Reciprocating Machining; High Rigidity to Suppress Cutting Vibration<\/td><td>Guarantee Uniform Wafer TTV Thickness and Avoid Hard Particle Contamination on Wafer Surface<\/td><\/tr><tr><td>Ultra-Precision Diamond Turning Lathe \/ Nano Grinding Machine<\/td><td>Integrated Water-Cooled SiC Gantry Base<\/td><td>Flatness \u22640.08\u03bcm\/mStraightness of Guide Rail Mounting Reference \u22640.04\u03bcm\/m<\/td><td>Uniform Heat Exchange in Water Flow Channels; Overall Machine Temperature Difference \uff1c0.08\u2103<\/td><td>Lightweight &amp; High Rigidity with Minimal Deformation During High-Speed Cutting<\/td><td>Machining of Optical Lenses &amp; Molds with Surface Shape Accuracy Within \u03bb\/50<\/td><\/tr><tr><td>High-Precision Coordinate Measuring Machine (CMM)<\/td><td>Solid SiC Sliding Base<\/td><td>Flatness: 0.1~0.15\u03bcm\/mPerpendicularity \u22640.1\u03bcm\/m<\/td><td>Low Thermal Expansion; Dimensional Drift Negligible Under Slight Ambient Temperature Fluctuations<\/td><td>Lighter Self-Weight with Faster Motion Response Than Granite<\/td><td>Realize Sub-Micron 3D Dimensional Inspection and Reduce Workload of Temperature Compensation<\/td><\/tr><tr><td>Space Optics \/ Space Telescope Payloads<\/td><td>Lightweight Hollow Water-Cooled SiC Base<\/td><td>Mirror Reference Surface Figure Accuracy \u03bb\/100 RMSOverall Flatness \u22640.05\u03bcm\/m<\/td><td>Stable Under Wide Temperature Range (-180\u2103~120\u2103) Without Obvious Deformation; High Thermal Conductivity for Rapid Temperature Equalization<\/td><td>30%~60% Weight Reduction; Radiation Resistance &amp; Micro-Vibration Resistance<\/td><td>Adapt to Extreme Space Temperature Differences, Lower Launch Load, and Maintain Long-Term Stable Surface Shape<\/td><\/tr><tr><td>MOCVD \/ Crystal Growth Equipment Carrier Substrate<\/td><td>Solid Constant-Temperature SiC Base<\/td><td>Flatness: 0.2~0.3\u03bcm\/m<\/td><td>High Temperature Resistance Above 1400\u2103, Excellent Thermal Shock Stability &amp; Uniform Heat Conduction<\/td><td>Low Outgassing &amp; Plasma Corrosion Resistance<\/td><td>Ensure Uniform Temperature Field on Wafer Epitaxial Layer and Reduce Crystal Defects<\/td><\/tr><tr><td>High-Computing AI Liquid Cooling Module Base<\/td><td>Integrated Microchannel Water-Cooled SiC Substrate<\/td><td>Assembly Reference Flatness \u22640.2\u03bcm\/m<\/td><td>Thermal Conductivity \u2265200W\/(m\u00b7K), Heat Dissipation for High Heat Flux Density<\/td><td>Insulating Property &amp; High Rigidity Without Leakage Risk<\/td><td>Rapidly Dissipate High Heat from GPUs and Stabilize Module Positioning Accuracy<\/td><\/tr><tr><td>Traditional Granite Base (Benchmark Reference)<\/td><td>Solid Stone Base<\/td><td>Flatness: 0.2~0.5\u03bcm\/m; Poor Thermal Conductivity, Unable to Embed Integrated Water Cooling<\/td><td>Thermal Conductivity: 3~5W\/(m\u00b7K); Prone to Warpage Under Local HeatingCoefficient of Linear Thermal Expansion: 4.5~6\u00d710\u207b\u2076\/\u2103<\/td><td>Heavy Weight; Surface Precision Degrades After Long-Term Wear<\/td><td>Only Applicable to Ordinary Micron-Level Equipment, Unable to Meet Nanoscale Thermal Control Requirements of Advanced Semiconductors<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<figure class=\"wp-block-image size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1000\" height=\"773\" src=\"https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/06\/20260618-151317.png\" alt=\"\" class=\"wp-image-3026\" srcset=\"https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/06\/20260618-151317.png 1000w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/06\/20260618-151317-300x232.png 300w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/06\/20260618-151317-768x594.png 768w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/06\/20260618-151317-16x12.png 16w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/06\/20260618-151317-800x618.png 800w\" sizes=\"(max-width: 1000px) 100vw, 1000px\" \/><\/figure>","protected":false},"excerpt":{"rendered":"<p>Domaine d'application Type de produit Indicateurs cl\u00e9s de pr\u00e9cision (surface de r\u00e9f\u00e9rence) Indicateurs de performances thermiques Indicateurs de r\u00e9sistance m\u00e9canique et aux vibrations Exigences essentielles de l'application Machines de lithographie de pointe (EUV \/ immersion ArF) Base de machine en SiC int\u00e9gr\u00e9e et refroidie \u00e0 l'eau \/ base de la platine de r\u00e9ticule Plan\u00e9it\u00e9 \u2264 0,05 \u03bcm\/m Rectitude \u2264 0,03 \u03bcm\/m Perpendicularit\u00e9 \u2264 0,05 \u03bcm\/m Rugosit\u00e9 de surface Ra \u2264 0,01 \u03bcm Conductivit\u00e9 thermique \u2265 180 W\/(m\u00b7K)Coefficient de dilatation thermique lin\u00e9aire \u22483,8\u00d710\u207b\u2076\/\u2103Diff\u00e9rence de temp\u00e9rature sur l\u2019ensemble de la surface\u2026<\/p>","protected":false},"author":1,"featured_media":3026,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_seopress_titles_title":"","_seopress_titles_desc":"","_seopress_robots_index":"","_seopress_robots_follow":"","_seopress_robots_imageindex":"","_seopress_robots_snippet":"","_seopress_robots_primary_cat":"","_seopress_robots_breadcrumbs":"","_seopress_robots_freeze_modified_date":"","_seopress_robots_custom_modified_date":"","_seopress_robots_canonical":"","_seopress_social_fb_title":"","_seopress_social_fb_desc":"","_seopress_social_fb_img":"","_seopress_social_fb_img_attachment_id":0,"_seopress_social_fb_img_width":0,"_seopress_social_fb_img_height":0,"_seopress_social_twitter_title":"","_seopress_social_twitter_desc":"","_seopress_social_twitter_img":"","_seopress_social_twitter_img_attachment_id":0,"_seopress_social_twitter_img_width":0,"_seopress_social_twitter_img_height":0,"_seopress_redirections_value":"","_seopress_redirections_enabled":"","_seopress_redirections_enabled_regex":"","_seopress_redirections_logged_status":"","_seopress_redirections_param":"","_seopress_redirections_type":0,"_seopress_analysis_target_kw":"","_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_kadence_starter_templates_imported_post":false,"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[35],"tags":[],"class_list":["post-3025","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"taxonomy_info":{"category":[{"value":35,"label":"NEWS"}]},"featured_image_src_large":["https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/06\/20260618-151317.png",1000,773,false],"author_info":{"display_name":"jinxing6611@gmail.com","author_link":"https:\/\/jtlcnc.com\/fr\/author\/jtlcnc\/"},"comment_info":0,"category_info":[{"term_id":35,"name":"NEWS","slug":"news","term_group":0,"term_taxonomy_id":35,"taxonomy":"category","description":"","parent":0,"count":363,"filter":"raw","cat_ID":35,"category_count":363,"category_description":"","cat_name":"NEWS","category_nicename":"news","category_parent":0}],"tag_info":false,"_links":{"self":[{"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/posts\/3025","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/comments?post=3025"}],"version-history":[{"count":1,"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/posts\/3025\/revisions"}],"predecessor-version":[{"id":3027,"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/posts\/3025\/revisions\/3027"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/media\/3026"}],"wp:attachment":[{"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/media?parent=3025"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/categories?post=3025"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jtlcnc.com\/fr\/wp-json\/wp\/v2\/tags?post=3025"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}