{"id":3115,"date":"2026-07-17T10:08:05","date_gmt":"2026-07-17T02:08:05","guid":{"rendered":"https:\/\/jtlcnc.com\/?p=3115"},"modified":"2026-07-17T10:08:07","modified_gmt":"2026-07-17T02:08:07","slug":"granite-semiconductor-lithography-machine-base-full-solution","status":"publish","type":"post","link":"https:\/\/jtlcnc.com\/es\/2026\/07\/17\/granite-semiconductor-lithography-machine-base-full-solution\/","title":{"rendered":"Granite semiconductor lithography machine base full solution"},"content":{"rendered":"<p class=\"wp-block-paragraph\">Full Solution for Granite Semiconductor Lithography Machine Base<br>I. Solution Overview<br>This solution is designed for EUV extreme ultraviolet lithography machines, ArF immersion lithography machines, and KrF lithography equipment. It utilizes a semiconductor-grade 000-level high-density diabase (Jinan Green \/ Indian Black) integrated granite base, paired with precision structural design, multi-stage aging processes, active vibration isolation, and an integrated constant temperature system. It addresses four core pain points of advanced 3nm\/2nm process nodes: sub-nanometer overlay accuracy, long-term thermal drift, workshop micro-vibrations, and cleanroom compatibility. It serves as the unique stable reference carrier for the lithography machine&#8217;s optical system, wafer stage, and interferometry module.<br>Integrated Granite Base for Lithography Machines<br>II. Core Material Selection and Key Performance (Lithography-Specific Indicators)<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Substrate: High-purity black diabase (semiconductor-grade granite)<br>Cuadro<br>Core Parameter Technical Indicator Value for Lithography Machines<br>Coefficient of Thermal Expansion (CTE) 2.5~3.8\u00d710\u207b\u2076\/\u2103 Only 1\/3 of cast iron, 1\/6 of aluminum alloy; deformation &lt;0.4\u03bcm for a 1m base with a 1\u2103 temperature difference, eliminating thermal overlay offset<br>Density \u22653100kg\/m\u00b3 High density and high damping, rapidly absorbing 1~100Hz workshop micro-vibrations, vibration transmission rate &lt; -20dB<br>Precision Grade DIN876 000 level (semiconductor exclusive) 1m flatness \u22641.5\u03bcm, verticality\/parallelism \u22640.0015mm\/m<br>Mohs Hardness 6.5~7 Higher than steel, no indentations from long-term friction with air-float guide rails, reference accuracy stable for ten years<br>Water Absorption Rate &lt;0.1%, vacuum impregnation sealing Non-absorbent, no dust precipitation, compatible with Class 1\/10 cleanrooms, resistant to lithography acid\/alkali cleaning solutions<br>Magnetism Completely non-magnetic, insulating Does not interfere with electron beams, laser gratings, or displacement sensors; no EMI electromagnetic error<br>Long-term Creep Geological natural aging of hundreds of millions of years, annual deformation &lt;0.3\u03bcm Equipment can run continuously 24h for 10 years without re-calibrating the reference<\/li>\n\n\n\n<li>Irreplaceability Compared to Metal Materials<br>Cast Iron: High thermal expansion, easy to magnetize, creep deformation in 2~3 years, only suitable for ordinary machining, prohibited for EUV use;<br>Aluminum Alloy: Extremely high expansion coefficient, tiny temperature changes cause 200nm deformation, unable to meet nano-lithography requirements;<br>Steel: Significant resonance, prone to rusting and generating metal dust, contaminating the wafer&#8217;s optical path.<br><\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">III. Complete Manufacturing Process (Exclusive to Lithography Machine Bases, Lead Time &gt; 6 Months)<br>Raw Material Screening<br>Ultrasonic non-destructive testing to reject raw stones with cracks or uneven quartz distribution; select only low-anisotropy high-purity mineral materials, controlling the three-axis thermal expansion difference to \u22640.3\u00d710\u207b\u2076\/\u2103.<br>Multi-stage Composite Aging (Core Process)<br>3-month natural resting to release geological stress;<br>20 cycles of thermal aging with temperature cycling from -5\u2103 to 40\u2103;<br>Low-frequency vibration aging to eliminate machining residual stress;<br>Mitigate risks of thermal stress cracking and datum drift during long-term equipment operation.<br>Integrated CNC Machining<br>Milling and grinding of guide rail mounting slots, vacuum suction channels, water-cooling embedded channels, and M8\/M12 precision threaded mounting holes in a single process; hole position accuracy \u00b10.008mm, using a single datum for the entire machine to eliminate cumulative geometric errors.<br>Multi-stage Precision Grinding Manual Super-finishing<br>Rough grinding \u2192 Semi-precision grinding \u2192 Precision grinding \u2192 Manual mirror polishing, surface roughness Ra\u22640.008\u03bcm; 000-grade flatness control, local flatness error of large-area gantry bases &lt;0.5\u03bcm\/\u33a1.<br>Vacuum Sealing and Clean Treatment<br>Vacuum impregnation with epoxy resin to seal stone micropores, preventing dirt accumulation and moisture adsorption, meeting cleanroom low-particle emission standards.<br>CMM Full-item Inspection Original English Measurement Certificate<br>Issuance of a complete set of inspection reports for flatness, perpendicularity, parallelism, thermal expansion, and vibration damping, matching the entry standards of overseas semiconductor equipment manufacturers.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">IV. Integrated Structural Design Solutions (Three Categories of Lithography Machine Bases)<br>Solution 1: EUV Lithography Machine Full-Machine Gantry Granite Base (Ultra-Large Integrated)<br>Dimensions: 4000\u00d72200\u00d7350mm monolithic cast granite gantry;<br>Built-in: Distributed microfluidic cooling channels to dissipate heat from light sources and linear motors;<br>Functions: Supports exposure optical modules, wafer XY air-bearing stage, and interferometry system;<br>Precision Requirements: Z-axis drift \u2264\u00b10.3nm during 72h continuous operation, overlay accuracy stability &lt;1.5nm.<br>Solution 2: ArF\/KrF Dry\/Immersion Lithography Platform (Medium-Sized Split Base)<br>Modular split granite structure, dual independent reference for optical bench wafer stage;<br>Bottom reserved for active isolator installation, side reserved for temperature sensor embedding slots;<br>Compatible with 200\/300mm wafer production lines, flatness Class 000, load deflection &lt;2\u03bcm.<br>Solution 3: Lithography Auxiliary Small-Scale Metrology Reference Platform (300\u00d7200\u00d760mm, extension of your company&#8217;s current models)<br>Specifications: 300\u00d7200\u00d760mm Class 000 semiconductor calibration platform;<br>Applications: Lithography lens calibration, wafer flatness spot checks, displacement sensor calibration;<br>Accessories: M6\/M8 standard threaded holes, original factory inspection certificate, compatible with cleanroom brackets.<br>V. Thermal Stability System Supporting Solutions (Core Solution for Temperature-Induced Drift)<br>Substrate Low Thermal Expansion Foundation Guarantee<br>Selection of specialized syenite with CTE \u22643.8\u00d710\u207b\u2076\/\u2103 to compress the upper limit of thermal deformation from the material level.<br>Built-in Water-Cooled Constant Temperature Circuit in Base<br>Integrated cooling channels embedded in the large gantry base, externally connected to a \u00b10.01\u2103 precision chiller to dissipate equipment heat in real-time and suppress local temperature gradients.<br>Cleanroom Environment Collaborative Temperature Control<br>Matching the 20\u00b10.01\u2103 constant temperature standard of lithography workshops, utilizing the high thermal inertia of granite to buffer instantaneous temperature fluctuations.<br>Distributed Multi-point Temperature Measurement Compensation<br>High-precision thermistor probes embedded in the base to collect real-time temperature fields, allowing equipment software to dynamically compensate for residual nanometer-scale thermal drift.<br>VI. Integrated Vibration Damping and Isolation System (Mandatory Vibration Control Requirements for Lithography Machines)<br>Lithography machines allow base vibration velocity \u226410\u03bcm\/s, granite base multi-stage isolation combination solution:<br>First-stage Damping: High-damping granite matrix itself<br>High-density stone rapidly attenuates 10~1000Hz high-frequency airflow and motor vibrations.<br>Second-stage Passive Isolation: High-damping air springs<br>Precision air-bearing isolation mounts at the base bottom to isolate ground pulsations and low-frequency vibrations from vacuum pumps.<br>Third-stage Active Vibration Control (AVC) Module<br>High-end EUV solutions equipped with acceleration feedback active vibration damping, reducing vibration transmissibility in the 1~50Hz frequency band to below -25dB, offsetting continuous disturbances from foot traffic and fans.<br>VII. Cleanroom Compatibility Solutions (Mandatory Requirements for Semiconductor Production Lines)<br>Mirror-polished surface vacuum-sealed holes, no micro-pores for dust accumulation, particle generation meets Class 1 cleanroom standards;<br>Entirely iron-free components, all stainless steel \/ titanium alloy fasteners, preventing iron rust dust from contaminating wafers;<br>Surface resistant to HF, photoresist stripper, and pure water spray corrosion, no discoloration or powdering over long-term use;<br>Compatible with anti-static coatings, suitable for electrostatic-sensitive lithography optical components.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">VIII. Delivery and Supporting Services<br>Delivery Documents: Original factory Class 000 precision inspection report, thermal expansion coefficient test certificate, vibration damping test report, English material data sheet;<br>Packaging: Fumigated solid wood anti-shock crate, fully wrapped in internal foam, suitable for ocean FOB export;<br>Warranty: 5-year precision warranty for the granite body, lifetime guarantee for temporal stability;<br>Customization Services: Integrated customization of dimensions, openings, water-cooling channels, threaded holes, anti-static coating, and active vibration isolation mounts.<br>IX. Summary of Core Solution Values<br>Extreme Thermal Stability: Low thermal expansion integrated water cooling, solving nanometer-scale thermal drift in advanced processes and improving chip yield;<br>Ultra-Stable Vibration Isolation Base: High-damping granite active vibration isolation, isolating all-frequency workshop micro-vibrations to ensure exposure pattern alignment precision;<br>Permanent Dimensional Stability: Natural aging of hundreds of millions of years, no creep deformation, significantly reducing annual equipment calibration and maintenance costs;<br>Dust-free and Magnetic-compatible: Suitable for lithography cleanrooms, no electromagnetic interference, protecting optical and wafer precision modules;<br>Integrated Assembly: One-time molding of guide rails, water cooling, and installation base, reducing cumulative errors from multi-component assembly.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img alt=\"\" fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"720\" src=\"https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/07\/\u5fae\u4fe1\u56fe\u7247_20260711110401_55_25-1024x720.png\" class=\"wp-image-3116\" srcset=\"https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/07\/\u5fae\u4fe1\u56fe\u7247_20260711110401_55_25-1024x720.png 1024w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/07\/\u5fae\u4fe1\u56fe\u7247_20260711110401_55_25-300x211.png 300w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/07\/\u5fae\u4fe1\u56fe\u7247_20260711110401_55_25-768x540.png 768w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/07\/\u5fae\u4fe1\u56fe\u7247_20260711110401_55_25-18x12.png 18w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/07\/\u5fae\u4fe1\u56fe\u7247_20260711110401_55_25-800x562.png 800w, https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/07\/\u5fae\u4fe1\u56fe\u7247_20260711110401_55_25.png 1128w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>","protected":false},"excerpt":{"rendered":"<p>Full Solution for Granite Semiconductor Lithography Machine BaseI. Solution OverviewThis solution is designed for EUV extreme ultraviolet lithography machines, ArF immersion lithography machines, and KrF lithography equipment. It utilizes a semiconductor-grade 000-level high-density diabase (Jinan Green \/ Indian Black) integrated granite base, paired with precision structural design, multi-stage aging processes, active vibration isolation, and an&#8230;<\/p>","protected":false},"author":1,"featured_media":3116,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_seopress_titles_title":"","_seopress_titles_desc":"","_seopress_robots_index":"","_seopress_robots_follow":"","_seopress_robots_imageindex":"","_seopress_robots_snippet":"","_seopress_robots_primary_cat":"","_seopress_robots_breadcrumbs":"","_seopress_robots_freeze_modified_date":"","_seopress_robots_custom_modified_date":"","_seopress_robots_canonical":"","_seopress_social_fb_title":"","_seopress_social_fb_desc":"","_seopress_social_fb_img":"","_seopress_social_fb_img_attachment_id":0,"_seopress_social_fb_img_width":0,"_seopress_social_fb_img_height":0,"_seopress_social_twitter_title":"","_seopress_social_twitter_desc":"","_seopress_social_twitter_img":"","_seopress_social_twitter_img_attachment_id":0,"_seopress_social_twitter_img_width":0,"_seopress_social_twitter_img_height":0,"_seopress_redirections_value":"","_seopress_redirections_enabled":"","_seopress_redirections_enabled_regex":"","_seopress_redirections_logged_status":"","_seopress_redirections_param":"","_seopress_redirections_type":0,"_seopress_analysis_target_kw":"","_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_kadence_starter_templates_imported_post":false,"_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"_kad_post_classname":"","footnotes":""},"categories":[35],"tags":[],"class_list":["post-3115","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"taxonomy_info":{"category":[{"value":35,"label":"NEWS"}]},"featured_image_src_large":["https:\/\/jtlcnc.com\/wp-content\/uploads\/2026\/07\/\u5fae\u4fe1\u56fe\u7247_20260711110401_55_25-1024x720.png",1024,720,true],"author_info":{"display_name":"jinxing6611@gmail.com","author_link":"https:\/\/jtlcnc.com\/es\/author\/jtlcnc\/"},"comment_info":0,"category_info":[{"term_id":35,"name":"NEWS","slug":"news","term_group":0,"term_taxonomy_id":35,"taxonomy":"category","description":"","parent":0,"count":310,"filter":"raw","cat_ID":35,"category_count":310,"category_description":"","cat_name":"NEWS","category_nicename":"news","category_parent":0}],"tag_info":false,"_links":{"self":[{"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/posts\/3115","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/comments?post=3115"}],"version-history":[{"count":1,"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/posts\/3115\/revisions"}],"predecessor-version":[{"id":3117,"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/posts\/3115\/revisions\/3117"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/media\/3116"}],"wp:attachment":[{"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/media?parent=3115"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/categories?post=3115"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/jtlcnc.com\/es\/wp-json\/wp\/v2\/tags?post=3115"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}