Natural granite is the preferred structural material for semiconductor inspection platforms, with extensive mature applications in wafe inspection, optical inspection, CMM measurement, AOI/X-ray inspection, probe stations, and metrology equipment. The following are specific, verifiable industry cases:
I. Wafespection and Metrology Equipment (Core Scenario)
- Wafer Automatic Optical Inspection (AOI) Platforms
Applications: Inspection of wafer surface defects, particles, film thickness, a linewidth.
Cases:
Wafer inspection machines from AMEC and Shanghai Micro Electronics Equipment (SMEE) use Jinan Blue / Mount Tai Blue granite bases with flatness eaching 0.05μm/m level.
Xiamen Jinshi Precision’s granite platforms hold approximately 19% market share in wafer inspection equipment, equipped with vacuum adsorption positioning uitable for 8/12-inch wafers.
Furuihua’s 6000mm×2000mm ultra-large platform is usen 12-inch wafer production lines, maintaining flatness stability at 0.0008mm for three consecutive years. - Probe Stations (Prober) and Wafer TesApplications: Wafer-level electrical parameter testing, probe card positioning, and chip yield detection.
Cases:
Advantest and Teradyne high-end probe stations feature precision granite core latforms and bases with a thermal expansion coefficient as low as 4.6×10⁻⁶/℃, ensuring micron-level probe positioning.
Domestic manufacturers like Changchuan Tenology and Hua Feng Test & Control use granite machine beds with vibration damping rates of 95% , improving test repeatability. - Coordinate Measuring Machinnd Precision Metrology Platforms
Applications: 3D dimensional inspection of semiconductor components, fixtures, molds, and packaging shells.
Cases:
Hexagon XPERT Series: Integral granite close measurement accuracy of 0.5μm, used for sub-micron level inspection of semiconductor components.
Zeiss CONTURA G2: Z-axi a 2.5-meter granite guide rail with straightness error <1μm within 1 meter.
Mainstream models from domestic CMM manufacturers (such as Sino Measuring and Edward) ard-equipped with granite platforms, suitable for semiconductor cleanrooms.
II. High-End Inspection Equipment (Lithography, X-ray, Laser Inspection)
- Lithography Alignment and Inspectin Platforms
Applications: Lithography machine alignment, mask inspection, and wafer overlay accuracy measurement.
Cases:
3nm/5nm process lithography machine stages: Use vacuum adsorption with surface roughness Ra≤0.05μm, controlling thermal deformation at the nanometer level.
SEMI Report: In China’s 12-inch waer fabs, 78% of lithography alignment and inspection stations specify granite platforms. - X-ray Inspection and CT Inspection Platforms
Applications: Inspection of internal chip defects, BGA slder joints, and interlayer shorts in packaging.
Cases:
X-ray inspection machines from Rayence and Zhaomao Technology use granite core bearing platforms to ensure stable geometric relationships between tation source and detector, preventing image distortion.
Granite platforms can shield against partial electromagnetic interference, improving X-ray imaging signal-to-noise ratio. - Laser Interferometers and Opticaon Platforms
Applications: Nanometer-level calibration of flatness, straightness, angles, and displacement.
Cases:
Renishaw and Agilent laser interferometers are paired with granite opticrms offering better thermal stability than metal, suitable for laboratory and production line calibration.
Shanghai Leishuo Precision’s “granite carbon fiber” composite platform reduces eight by 30% without sacrificing precision, used for high-end optical inspection.
III. Packaging and Back-end Inspection Platforms
- Packaging Visual Inspection (AOI/3D Inspection)
Applications: Chip apperance, lead, ball placement, and marking inspection
Case Studies:
JCET and Tongfu Microelectronics’ packaging lines adopt granite platforms as vision inspection bases with flaess ≤0.003mm/m, ensuring image acquisition accuracy. - Dicing Machine / Cutting Machine Base
Applications: Precision positioning for wafer cutting, thinning, and dicing prCase Studies:
Disco dicing machine frames use monolithic granite, offering vibration damping superior to cast iron with cutting accuracy reaching ±1μm.
IV. Typical Materials and Precision Specns (Industry Benchmarks)
Mainstream Stones: Jinan Green, Mount Tai Green, Wulian Red, Fujian G654, Sichuan Ya’an Black, Slack Granite
Core Precision:
Flatness: 0.001–0.05μm/m (Grade 000 / Grade 00oughness: Ra≤0.005–0.05μm (Mirror / Optical Grade)
Coefficient of Thermal Expansion: ⁻⁶/℃ (Approximately 1/20th of steel)
Vibration Damping: 5–10 times higher than cast iron
V. Leading Domestic Suppliers and Benchmarkustomers
Furuihua: Serving SMIC and Yangtze Memory Technologies, with ultra-large platforms (6m×2m) applied in 12-inch production l.
Xiamen Jinshi Precision: Approximately 19% market share in wafer inspection equipment, equipped with vacuum adsorption technology.
Shanghai Jingshi / Leishuo: Serving Adnced Micro-Fabrication Equipment (AMEC) and Shanghai Micro Electronics, core suppliers of semiconductor equipment in the Yangtze River Delta.
Kesite: 3m×tforms reach Grade 00, serving national key laboratories and semiconductor production lines.
Summary:
Natural granite, with its extreme stability, low expansion, high damping, and high r, has become the irreplaceable material of choice for semiconductor inspection platforms, covering the entire process of precision inspection from wafer front-end to packagi
